Communication & Semiconductor

Low Closure Force, Foam-Based

Foam-based gaskets offer a balance of flexibility, performance, and cost-efficiency. Available in multiple sizes and configurations, they provide effective shielding and sealing without requiring high compression forces. This makes them ideal for lightweight assemblies or applications where ease of installation and durability are equally important.

Metal Gaskets

Metal-based gasket solutions are engineered for strength and durability in shielding and sealing environments. Their robust construction allows them to withstand challenging conditions while providing consistent protection against leakage or interference. They are well-suited for applications that demand reliability over long service lives.

Heat Spreaders

Heat spreaders are designed to distribute and dissipate heat in compact or high-power systems where space is limited. By reducing local hot spots and lowering component temperatures, they support greater efficiency and extend device performance. Their versatility makes them an effective solution in everything from consumer electronics to industrial systems.

Phase-Change Thermal Interface Material

Phase-change materials deliver a dependable way to maximize heat sink efficiency by reducing thermal resistance at the interface point. As they transition during operation, they create a stable, low-resistance path that improves cooling consistency. This enhanced performance helps protect sensitive electronics and contributes to longer-lasting, more reliable assemblies.

Thermally Conductive Adhesive Tapes

Adhesive tapes combine strong bonding with thermal management in one solution. They allow heat sinks and other components to be secured without mechanical fasteners, simplifying assembly while ensuring reliable conductivity. Their balanced thermal, mechanical, and environmental properties make them highly adaptable to a variety of design requirements.

Thermally Conductive Fully Cured Dispensable Gap Fillers

Gap fillers are engineered to conform to uneven surfaces and fill air voids, providing an efficient path for heat transfer across complex assemblies. Their cured formulation ensures long-term stability, helping to draw heat away from high-power components into sinks or chassis areas. This makes them especially useful where space is limited and cooling demands are high.

Thermally Conductive Insulators

These insulating materials are designed to efficiently move heat away from sensitive components while maintaining strong electrical insulation. By channeling thermal energy into sinks or other cooling devices, they help protect circuits, extend operating life, and improve overall system reliability in a wide range of applications.

Thermal Greases and Gels

Greases and gels provide a simple yet effective way to improve contact between components and cooling surfaces. Their conformable, non-curing nature allows them to fill voids and irregular surfaces, ensuring consistent thermal transfer without adding assembly stress. These materials support stable performance over time and help safeguard delicate joints under demanding conditions.